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Galerkin Approximation of a Shielded Double-Sided Microstrip Line with Boundary Singularities

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Abstract
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We provide a mathematical and numerical analysis for solving an eigenvalue boundary value problems (Dirichlet and Neumann) for Helmholtz operator, which describes a regular shielded double-sided microstrip transmission line problem. The paper presents a new adapted method for numerical calculation of dispersion characteristics of this problem, and, in particular, balanced microstrip line problem. The boundary value problem for a regular planar transmission line is solved in a rigorous formulation considering the singularity of the behavior of the current density at the edges of the microstrips. The method of discretization by Galerkin approximations of the boundary value problem using an additional basis from Chebyshev polynomials of the 1st and 2nd kind was adapted for the case of a doubly connected domain (two electrodynamically coupled microstrip lines). In an explicit form, the matrix elements for the system of linear algebraic equations were obtained, the solution algorithm of which was implemented in a high-performance computing environment. The dispersion characteristics of a double-sided microstrip and balanced transmission line made on the RO3010 substrate material were calculated using the developed algorithm. As an example of using the obtained dispersion characteristics, a circuit was designed and the scattering characteristics of tapered transition with an exponential profile from a double-sided microstrip with a characteristic impedance Z0 = 50 Ohm to a balanced transmission line with a impedance of Z0 = 100 Ohm were obtained. According to the results of the analysis of exponential transitions with exponents n = 0.707 and n = 1.0 in the function of the strip width versus the longitudinal coordinate, the reflection coefficient is below |Γ| < 0.1.

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Nowadays, demands for compactness, light weight, and broadband have a great impact on design issues at both component and system levels in wireless communications. Multilayered structures fabricated with low-temperature co-fired ceramic (LTCC) technologies have been developed recently in response to these demands. With this trend, double-sided printed circuits using conventional fabrication techniques with lower cost have been receiving plenty of attention. The parallel-strip line, belongs to the family of balanced transmission lines. The conventional printed circuit board technology is able to realize it easily. It is a simple structure comprised of a piece of dielectric substrate sandwiched by two conducting traces. Signals flowing on the upper and lower conductors are always equal in magnitude and 180° out of phase; therefore, parallel-strip line has an inherent advantage of easy realization of a balanced configuration. Balanced or double balanced microwave circuits, such as amplifier, mixer, and antenna, are frequently employed in high-performance wireless communications systems, and they can be directly fed by parallel-strip lines. In contrast, microstrip line is an unbalanced transmission line; therefore, extra effort of designing balanced to unbalanced structures (balun) is required for using microstrip transmission lines.

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