Abstract
Fracture toughness of submicron grain size tetragonal zirconia polycrystals doped with 3 mol% yttria (3Y-TZP) is measured by the single edge V-notch beam (SEVNB) method from a shallow sharp notch produced by ultra-short pulsed femtolaser ablation (UPLA) on the surface of a bending bar. It is shown that the radius of the notch tip achieved is in the submicron range and the damaged volume in front of the notch tip is characterized by using focus ion beam milling and scanning electron microscopy. It consists of a narrow fully microcracked region less than ∼4 μm wide and ∼15 μm deep in front of the notch. If the extension of this region and the length of the notch are used in the determination of the fracture toughness (KIc) in the four bending test, the values obtained for submicron grain size 3Y-TZP are in agreement those obtained by using very sharp cracks. It is concluded that the SEVNB testing method with a sharp notch induced by UPLA may be used for KIc testing of submicron grain size ceramics.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
