Abstract
The effect of temperature on the fracture behaviour of a microcapsule-loaded epoxy matrix was investigated. Microencapsulated epoxy and mercaptan-derivative healing agents were incorporated into an epoxy matrix to produce a polymer composite capable of self-healing. Maximum fracture loads were measured using the double-torsion method. Thermal aging at 55 and 110°C for 17 hours (hrs) was applied to heal the pre-cracked samples. The addition of microcap- sules appeared to increase significantly the load carrying capacity of the epoxy after healing. Once healed, the composites achieved as much as 93-171% of its virgin maximum fracture load at 18, 55 and 110°C. The fracture behavior of the micro- capsule-loaded epoxy matrix was influenced by the healing temperature. The high self-healing efficiency may be attributed to the result of the subsurface micro-crack pinning or deviation, and to a stronger microencapsulated epoxy and mercaptan- derivative binder than that of the bulk epoxy. The results show that the healing temperature has a significant effect on recov- ery of load transferring capability after fracture.
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