Abstract
Metal-organic decomposition (MOD) inks have been developed for printed electronics applications. Cu-based MOD inks prevent the oxidation of the metal during storage, as the Cu is already present in an oxidized form (i.e. a salt). However, usually hazardous formates such as Cu (II) formate have to be used as the copper salt in order to ensure thermal decomposition and self-reduction of the metal salt at moderate temperatures (less than 150°C). In this study, a formate-free hybrid ink containing copper particles and a Cu/1-amino-2-propanol (AmIP)/acetate complex was developed for the fabrication of conductive copper films on flexible polymer substrates at low sintering temperatures. A hybrid ink with a weight ratio of 3:1copper particles to MOD ink produced a conductive copper film with close-packed copper particles and a low resistance of 7.3—10-5Ω cm after sintering at a temperature of 180°C for 60 min under a N2 gas flow. Good oxidation resistance of the copper films was observed after exposure to air at 23 °C for two months.
Highlights
Copper-based conductive inks are of great interest for printed electronics, due to their high conductivity, low cost, and reduced electro-migration effect
Alternative metalorganic decomposition (MOD) inks based on copper carboxylate have been developed from the view point of being formate free to achieve adequately conductive copper films, the sintering temperatures are relatively high [14]
We present a formate-free hybrid MOD ink containing copper particles and Cu (II)/AmIP/acetate complex for the fabrication of conductive copper films on flexible polymer substrates
Summary
Copper-based conductive inks are of great interest for printed electronics, due to their high conductivity, low cost, and reduced electro-migration effect. Alternative MOD inks based on copper carboxylate have been developed from the view point of being formate free to achieve adequately conductive copper films, the sintering temperatures are relatively high (above 250 °C) [14]. Another issue in MOD copper inks is the low Cu content (typically 20wt %) in the ink compared to the Cu nanoparticlebased ink (more than 40 wt %). We present a formate-free hybrid MOD ink containing copper particles and Cu (II)/AmIP/acetate complex for the fabrication of conductive copper films on flexible polymer substrates. Journal of Coating Science and Technology, 2016, Volume 3, No 2 of ~ 7 × 10−5 Ω cm after sintering at a temperature of 180 °C under a N2 gas flow without reducing gas such as hydrogen and formic acid
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