Abstract
AbstractIn recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state‐of‐the‐art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified.
Highlights
As a device becomes more compact and efficient, its output power increases, performance improves, and specific costs decrease
To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state-of-the-art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges
A variety of working fluids with special physical properties and phase transitions that are tunable through additives or inhibitors, applied pressure, and even magnetic or electric fields are available, and fluidic TCDs can be used in a wide temperature range from very high temperatures to cryogenic ones
Summary
As a device becomes more compact and efficient, its output power increases, performance improves, and specific costs decrease. Where the heat flux in the forward direction Q fwd is supposed to be larger than that in the reverse direction Q rev Another important parameter is the characteristic time τ (for on/off or off/on switching or response time in thermal diodes) required for the TCD to change its thermal resistance. Remarks and some ideas for future work on different fluidic and mechanical TCDs. Further, the Supporting Information contains tables that summarize the characteristics of and compare different types of TCDs. switch allows heat flux from one to the other. By contrast, during the off state, the high thermal resistance between the two prevents heat flux
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