Abstract
Self-aligned double patterning (SADP) is a promising manufacturing option for sub-22nm technology nodes. Studies have shown that SADP provides better overlay control than traditional litho-etch-litho-etch double patterning. However, the use of stitch is not allowed, which makes layout decomposition for SADP more difficult. It is necessary to find a new solution to handle pattern conflicts and consider SADP in earlier stages. In this paper, we propose a novel multi-layer SADP-aware detailed routing with prescribed layout planning. Our method is based on a correct-by-construction approach to take SADP compliancy into account during routing, and to achieve layout decomposition simultaneously. The experimental result shows that the proposed approach consistently achieves SADP-compliant solutions on both single-layer and multi-layer designs.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
