Abstract
The development of polyimide based multilayer flexi‐rigid boards has opened up new horizons in packaging and interconnections. It is now possible to design small electronic systems in which every component can be mass‐soldered to a single interconnect and component mounting unit. Large boards can be made to fold up to fit into small cases, and boards can be designed to fit into awkward shaped spaces such as round the neck of a crt in a video display unit.
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