Abstract
A lapping/polishing machine has been newly designed and constructed to produce precise flat surfaces efficiently. The machine can control the shape of a base plate to within a few microns by varying pressure distribution and rotating speed. Stable floating and vibration suppression to less than 1 μm for the base plate are attained by using hydrodynamic bearings. Accurate and large loading are also attained by using parallel leaf springs. The base plate surface is lapped within a few microns by controlling the pressure distribution. In silicon wafer polishing, work plates are deformed due to polishing heat. Therefore, two-layer discs with a larger coefficient of thermal expansion in the upper layer were used. As a result, it has been proved that highly accurate polishing may be attained efficiently by using the machine
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
