Abstract
Abstract We investigated the effects of photosensitive system (positive and negative) and polymer structures on Cu migration under bias HAST test. The HAST condition is 130C for 85% RH. Bias condition is 2MV/m. We found that there is polyimide structure shows big effect is big effect of no big difference between negative photosensitivity and positive photosensitivity in photo sensensitive polyimides. Polyimide structure effects significant difference on Cu migration under bias HAST condition. Cu migration of soft polyimide seems better than that of rigid polyimide. From these results, we developed good reliable photosensitive polyimide B-sheet having fine pattern capability successfully.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
