Fine-pitch connection to rigid substrate using non-conductive epoxy adhesive

Abstract

Journal of Electronics ManufacturingVol. 02, No. 01, pp. 7-12 (1992) PAPERSNo AccessFine-pitch connection to rigid substrate using non-conductive epoxy adhesiveHELGE KRISTIANSEN and ARE BJORNEKLETTHELGE KRISTIANSENCentre for Industrial Research, Forskningsveien 1, Mail Box 124 Blindern, 0314 Oslo 3, Norway Search for more papers by this author and ARE BJORNEKLETTCentre for Industrial Research, Forskningsveien 1, Mail Box 124 Blindern, 0314 Oslo 3, Norway Search for more papers by this author https://doi.org/10.1142/S0960313192000030Cited by:9 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractWe have carried out reliability testing of different interconnection technologies, mainly to connect driver electronics to liquid crystal displays. This work has involved connection between flexible circuits made of Kapton, and rigid glass substrates. One of the applications also involved connection between flexible circuits and FR-4 substrates. Tests have been performed both on test structures and on real displays. The two different interconnection technologies we have studied are anisotropic conductive films (ACF) and non-conductive epoxy adhesive (NCA). Anisotropic conductive film is at present extensively used in producing high-quality LCDs. The other technology is, as far as we know, not used in production at this moment. Anisotropic conductive films contain a small volume fraction of conductive particles to accomplish electrical conductivity between the two connected contact areas. With non-conductive adhesive we use the surface roughness on the individual contact areas to establish electrical contact. In comparison with conventional anisotropic conductive film (ACF), based upon thermoset adhesives, the use of non-conductive adhesive (NCA) has proved to be superior with respect to reliability. This result is verified by thermal cycling (−30°C to 90°C) and by humidity testing (85% RH/85°C), both on test structures and real displays.Keywords:Fine-pitch electrical connectionliquid crystal displaynon-conductive adhesiveanisotropic-conductive filmreliability FiguresReferencesRelatedDetailsCited By 9Conductive Adhesives for Flip-Chip ApplicationsDaoqiang Daniel Lu and C. P. Wong4 January 2013A Method to Connect Flexible Printed Circuits and Indium Tin Oxide Electrodes Using Non-Conductive Film and PlatingYohei Wakuda, Yoshiyuki Okura, Koichiro Kawate, Hideaki Yasui and Mitsuhiro Watanabe et al.1 Jan 2008 | Transactions of The Japan Institute of Electronics Packaging, Vol. 1, No. 1Koichiro KAWATE1 Jan 2007 | Journal of The Surface Finishing Society of Japan, Vol. 58, No. 12Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applicationsW. K. Chiang, Y. C. Chan, Brian Ralph and Andrew Holland1 Mar 2006 | Journal of Electronic Materials, Vol. 35, No. 3Overview of conductive adhesive interconnection technologies for LCDsH. Kristiansen and J. Liu1 Jun 1998 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 21, No. 2Characterisation of electrical contacts made by non-conductive adhesiveH. Kristiansen, M. Gulliksen, H. Haugerud and R. FribergElectrical conductive characteristics of ACA bonding: a review of the literature, current challenges and future prospects Guangbin Dou, D.C. Whalley and Changqing LiuRecent advances in conductive adhesives for direct chip attach applicationsJ. LiuOverview of conductive adhesive interconnection technologies for LCD'sH. Kristiansen and J. Liu Recommended Vol. 02, No. 01 Metrics History Received 1 September 1991 Accepted 1 October 1991 KeywordsFine-pitch electrical connectionliquid crystal displaynon-conductive adhesiveanisotropic-conductive filmreliabilityPDF download