Abstract

AbstractPIQ (patented) is known to be a very effective polymer for use in planar multilevel interconnection technology. To realize fine patterns and a high order of integration of this technology, we studied a wet‐etching mechanism with an etchant based on hydrazine hydrate. Hydrazine hydrate is known to be an etchant for the PIQ, as are also NaOH and KOH. However, hydrazine hydrate is not suitable for fine‐pattern technology because it causes a region of swelling in PIQ film. We analyzed the swelling region by infrared spectroscopy and found that ethylenediamine solves the swelling quite effectively. Based on these results, we developed a new etchant containing hydrazine hydrate and ethylenediamine. The new etchant enables the creation of stable 3 μ2 via‐holes in the PIQ film. The electrical properties of these holes are also found to be quite good.

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