Abstract
Dielectric properties of low-loss dielectric materials are investigated with variation of silica filler which is known to be general filler in PCB composite. With comparison of dielectric losses of various filler materials in use of BCB resin, it could be known that crystalline cristobalite was superior to other crystalline or amorphous silica-base materials and reduced dielectric losses in the composite with resin. And dielectric properties of composite with the variation of filler quantity showed that amorphous silica and quartz increased dielectric loss as their quantities increased, while cristobalite increased little. As quantity of crystalline cristobalite phase increases in cristobalite/quartz intermediates, dissipation factor decreases.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
