Abstract
The transmission electron microscope(TEM) is one of the most powerful instrument in materials characterization, and various TEM specimen preparation methods have been developed. It is known that Ar-etching method is most widely applied in the studies of high technology materials. However, it is time-consuming when a specific area is desired for examination. Because it is necessary to iterate through Ar-ion etching and TEM examination until the desired information is obtained.There is a great demand on a new specimen preparation technique that has high positional accuracy, reliability, and throughput.Focused ion beam (FIB) milling has been proposed as a solution to the above requirements. We have developed the FIB system (FB-2000) for SEM/TEM specimen preparation. An external view of the system is shown in Fig.l. The system is designed to use a compatible specimen holder (Fig.2) which allows both FIB milling and TEM observation without re-mounting the specimen. The instrument has maximum accelerating voltage of 30kV and a minimum beam diameter of lOnm. The FIB current density of 15A/cm2 is available.
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