Abstract
FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis, and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mould because of low productivity and sputtering rate has also been required to fabricate the 3D shape. In this paper, we studied the FIB-sputtering rate according to mould materials. As well, surface roughness characteristics were analysed for micro and nano mould fabrication. The Si wafer, GC (glassy carbon), STAVAX, and DLC that have been normally considered as good micro or nano mould materials were used in this study. And also we carried out experiments for productivity of improvement of FIB process. The blu-ray DVD pattern and the nano grid pattern were made using the GC material. In addition, the wave guide mould was fabricated using the DLC material as a test sample to improve the productivity.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
