Abstract
The possibility of obtaining Ta2O5 films with homogeneous properties on the surface of substrates possessing complicated shapes was studied. In the deposition systems employing point molecular sources of a vapor flow, the problem is solved by using various planetar manipulators ensuring complicated rotations of the substrates in a vacuum chamber; in the case of magnetron sputtering, a more technological method can be realized based on the controlled transport of sputtered particles in the target-substrate drift space. The transport of sputtered particles is described using various models and static modeling techniques, which can be also of interest for solving numerous applied problems in the physics of gas discharge. The results were used to optimize the technology of Ta2O5 film deposition onto large-size substrates of complicated configurations.
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