Abstract
A breadboard heat pump was designed and built to test the performance of a vapour compression heat pump with two-stage ammonia-water solution circuits. A major improvement in performance was obtained by incorporating a bleed line to attain water balance between the high and the low temperature solution circuits. The new scheme was first investigated by computer simulation and then incorporated in the experimental setup. The advantages of this scheme are reduced first cost (by eliminating the need for a rectifier), a simplified system and its control mechanisms, a 20–30% improvement in cooling coefficient of performance and a 10–15% increase in cooling capacity as compared to the system with a rectifier. Coefficients of performance in the range of 0.69 to 1.04 were obtained experimentally for a temperature lift of 100 K and cooling capacities in the range of 2.02 to 4.22 kW. The pressure ratios encountered were in the range of 6.9 to 11, which are 35 to 50% of the pressure ratio expected for a conventional single-stage heat pump.
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