Abstract
Power system interconnections using high-voltage direct-current (HVDC) technologies between different areas can be an effective solution to enhance system efficiency and reliability. Particularly, the multi-terminal DC grids, that could balance and ensure resource adequacy, increase asset utilization and reduce costs. In this paper, the technical feasibility of building DC grids using the line commutated converter based (LCC) and voltage source converter based (VSC) HVDC technologies are discussed. Apart from presenting the technical challenges of building LCC DC grids and LCC/VSC hybrid DC grids, the reliability modeling and analysis of these DC grids are also presented. First, the detailed reliability model of the modular multi-level converters (MMCs) with series connected high-voltage and low-voltage bridges are developed. The active mode redundancy design is considered for the reliability model. To this end, a comprehensive whole system reliability model of the studied systems is developed. The reliability model of each subsystem is modeled in detail. Various reliability indices are calculated using this whole system reliability model. The impacts of the redundancy design of the MMCs on these indices are presented. The studies of this paper provide useful guidance for DC grid design and reliability analysis.
Highlights
High-voltage direct-current (HVDC) technology which has been used for more than 70 years [1]–[3], is suited to transport large amounts of power over long distances with minimum losses
Over the last two decades, the voltage source converter (VSC) based high-voltage direct-current (HVDC) technology has become more attractive compared to the line-commutated converterbased (LCC)-HVDC for building multiterminal DC (MTDC) grids [7], [8]
As the modular multi-level converters (MMCs) do not have the problem of commutation failure, the block of the virtual device of commutation failure (VDoCF) will be removed if the converters are MMCs
Summary
GEN LI 1, (Member, IEEE), JUN LIANG 1, (Senior Member, IEEE), TIBIN JOSEPH 1, (Member, IEEE), TING AN 2, JINGJING LU2, MARCIO SZECHTMAN3, (Life Fellow, IEEE), BJARNE R.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
