Abstract
Load-controlled fatigue and dwell-fatigue tests were conducted at elevated temperature to describe the high temperature mechanics behavior of nano-silver sintered lap-shear joints. The results showed that the shear strength of nano-silver sintered lap-shear joints was strongly temperature dependent, and almost halved at the temperature of 325°C. The Basquin model was used to assess the fatigue life of the joints at elevated temperature and the constants in the model were figured out, which yielded good prediction for experimental data. In dwell-fatigue tests, at the temperature of 325°C, creep was found the dominant factor that resulted in failure acceleration and cyclic life reduction. With the temperature decreasing to 225°C, the creep played a less important role to the total deformation.
Highlights
Nowadays, the use of tin-lead solder in certain application has been banned for its damage on healthy
To raise the sintering driving force of this interconnection material, the paste formed by nano-sized silver powder, which gained the close attention of both scientists and power electronics engineers, was introduced by Lu et al [6]
Tensile and fatigue tests and creep-fatigue tests were conducted in this article in order to understand the failure mechanism of nano-silver sintered lap shear joint at elevated temperature, study any possible relation between creep and fatigue in the low-cycle regime and learn the probabilistic observed mechanisms The creep-fatigue tests were conducted at the temperature of 325°C, at which both dwell time and fatigue process interacted and failure occurred in the low-cycle regime
Summary
The use of tin-lead solder in certain application has been banned for its damage on healthy. Yu et al studied the tensile behaviors of low-temperature sintered nano-silver films and proved that accumulation of plastic strain took place in silver-bonding layer during thermal cycling, which might lead to the final failure of the chip-attachment [8]. Mass of creep test data at elevated temperatures [9] These studies only revealed the properties of sintered silver film, which in turn imposed a limitation to consider the thermally induced strain due to thermal expansion coefficient mismatch between substrate and chip in actual applications. Tensile and fatigue tests and creep-fatigue tests were conducted in this article in order to understand the failure mechanism of nano-silver sintered lap shear joint at elevated temperature, study any possible relation between creep and fatigue in the low-cycle regime and learn the probabilistic observed mechanisms The creep-fatigue tests were conducted at the temperature of 325°C, at which both dwell time and fatigue process interacted and failure occurred in the low-cycle regime
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