Abstract
An efficient transient thermal simulation of 2.5-D integrated system with through silicon via (TSV) interposer is presented by the equivalent thermal model and the alternating-direction-implicit (ADI) method. The equivalent thermal conductivities of TSV interposer and bump layers are extracted properly. The temperature-dependence of thermal conductivity is taking into account in the modeling as well. With the ADI technique, the heat conduction equations in the matrix form are derived and calculated with linear computational complexity. The validity and high-efficiency of the proposed method are illustrated by the numerical examples.
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