Abstract
The capacity of chemically-assisted focused ion beam (FIB) etching systems to undertake direct and highly anisotropic erosion of thin and thick gold (or other high atomic number {Z}) coatings on X-ray mask membranes/substrates provides new levels of precision, flexibility, simplification and rapidity in the manufacture of mask absorber patterns, allowing for fast prototyping of high-aspect ratio, high-resolution masks for deep X-ray lithography for the LIGA process. In preliminary demonstrations, an automated FIB system operating at 30 keV with a gallium liquid metal source and an iodine gas injection system was used for direct milling into a few micrometer thick gold of microstructures into the sub-hundred nanometer regime. Three-dimensional micromachining in bulk diamond is also reported to illustrate the capability of the technique.
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