Abstract

Near-field calculation for a three-dimensional (3D) mask is a fundamental task in extreme ultraviolet (EUV) lithography simulations. This paper develops a fast 3D mask near-field calculation method based on machine learning for EUV lithography. First, the training libraries of rigorous mask near fields are built based on a set of representative mask samples and reference source points. In the testing stage, the mask under consideration is first segmented into a set of non-overlapped patches. Then the local near field of each patch is calculated based on the non-parametric regression and data fusion techniques. Finally, the entire mask near field is synthesized based on the image stitching and data fitting methods. The proposed method is shown to achieve higher accuracy compared to the traditional domain decomposition method. In addition, the computational efficiency is improved up to an order of magnitude compared to the rigorous electromagnetic field simulator.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.