Abstract
In this paper, the broadband Green’s function with low wavenumber extraction (BBGFL) is applied to modeling of traces connecting vias in arbitrarily shaped power/ground planes of printed circuit boards (PCBs). The proposed modeling method is a hybrid technique based on mode decomposition: BBGFL is used to fast compute the vias in power/ground planes, MoM is used to calculate the impedance matrix of the traces, and a physical circuit model is then applied to combine the vias and traces in the power/ground planes. The present method is compared to the method of moments (MoM) and the commercial tool HFSS. Results show that the results of the present technique are in good agreement with MoM and HFSS on the radiated emissions from PCBs. BBGFL is several hundred times faster than HFSS in CPU time for broadband simulations. The technique provides a fast broadband solution for system-level modeling of high-speed interconnects with vias and traces in electronic design automation design and applications.
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