Abstract

In article 2100161, Gan, Li, and co-workers study the core-shell structure composite conductive microsphere Sn@Ag, combined with resin, creates an anisotropic conductive film (ACF) with a flexible core. The reducibility of Sn is used to omit the preparation process of active sites, and the facile preparation of Sn@Ag is completed in one step. The proposed ACF can be deformed during the packaging process to reduce the uneven particle size problem and improve the conductivity.

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