Fabrication of superamphiphobic micro-reentrant structures by inverted electrochemical deposition

Abstract

Due to excellent oil resistance and shortened liquid-solid contact time, superamphiphobic surfaces have promising application prospects in oil transportation, and petroleum pollution control. Although superamphiphobic surfaces have been constructed on various substrates, there is still a lack of high-efficient methods for fabricating micro-reentrant structures on engineering metal substrates. This paper proposes a new method combining laser processing and inverted electrochemical deposition techniques to achieve high-efficient and large-scale fabrication of superamphiphobic surfaces on copper substrates. Firstly, micropillar array structures are constructed by laser processing, and the structures exhibit excellent superhydrophobicity after low surface energy modification. Then, inverted electrochemical deposition is performed after polishing the top of the array, and local angle of the gas/liquid interface can be controlled by adjusting the distance between the top of the micropillar and the electrolyte level, thus regulating micro-morphology of the roof structure. The influences of electrochemical deposition parameters on characteristics of the micro-reentrant structures are systematically investigated. Finally, superamphiphobic micro-reentrant structures (roof diameter > 190 μm, micropillar spacing <250 μm) with water and oil contact angles exceeding 150° are prepared after lowering the surface energy of the deposited structures. After anti-fouling, blowing, ultrasonic vibration, and tape adhesion tests, the prepared superamphiphobic micro-reentrant structures maintained good water and oil repellency, showing excellent chemical stability and durability. The research may provide a simple, efficient, and low-cost method for high-efficient constructing superamphiphobic surfaces on engineering metal substrates, enriching the fabrication techniques of micro-reentrant structures and facilitating their practical applications.