Abstract
This paper studies an anodic oxidation method (AOM) for improving the adhesion strength between SU-8 photoresist and titanium substrate. The adhesion was increased by approximately 86% through anodic oxidation treatment compared to Si wafer substrate. Moreover, the adhesion strength was further strengthened by hard baking at 110°C and its value was up to 71.64 MPa, which almost approaches the breaking strength of SU-8 polymer. The high aspect ratio (24) SU-8 micropillar arrays with 600 μm height were fabricated without any distortion, collapse and delamination. The treated titanium substrate can also serve as a seed layer for electroplating.
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