Abstract
A high-performance 160 Gbps (=20 GB/s) optical semiconductor module using an optoelectronic (OE) ferrule with the ultra-compact size of 4.4 times 4.5 times 1.0 mm3 was developed for the first time in the world. The ferrule is used as the interface of OE converter in our developed optoelectronic LSI package of over 1 Tbps, POST LSI package (post-reflow optical-interface stacking technique LSI package). The feature of this OE ferrule is to have fine-pitch lead frame electrodes formed by insert molding method, which realized highly reliable electric contacts and excellent electric characteristics of the module. Moreover, the high-density assembly of 12 ch optical semiconductor module coupling an optical semiconductor device and an optical fiber array was realized by a simple assembly process with high accuracy and high reliability.
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