Abstract
Polymethylglutarimide (PMGI) based resists are commercially available resists intended for use in bilayer lift-off applications. Literature on exposure and development of PMGI films is restricted to films less than 2.5um in thickness, and limited to using TMAH based developers. This paper investigates the exposure and development of PMGI thick films greater than 6um in thickness using both TMAH and TEAH based developers. At this thickness, the absorption of the PMGI leads to non-uniform doses through the film, and so creates large gradients in the dissolution properties. Etch rates as a function of surface dose and development time are reported in this paper.
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