Abstract
Gas purification is an integral part of many semiconductor manufacturing processes. Accidental air contamination into gas delivery systems can lead to adverse consequences. This paper addresses the use of inorganic nickel-based purifiers versus organomentallic resin-based purifiers in the event of air intrusion. Tests were performed under conditions that simulate a large purging error. Both purifier technologies undergo reaction exotherms. Hydrocarbon oil release, which results in catastrophic system contamination, occurs with organometallic resin purifiers. For nickel-based purifiers, system contamination is limited to air breakthrough.
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