Abstract
Thermal management is an important issue for electronic cooling application. Choosing an efficient cooling technique depends on thermal performance, reliability, manufacturing cost, and prospects for minimization of packaging cost. Based on these grounds, Loop heat pipe (LHP) is a highly efficient two-phase cooling system used for passive cooling of critical components especially in satellite technology. Loop Heat Pipe uses capillary action to circulate cooling fluid. The capillary pressure developed in the pores of the wick material provides the driving force to pump the fluid. A loop heat pipe with flat evaporator has been designed and fabricated. An experimental study was performed to investigate the loop performance at different heat loads. LHP was instrumented with thermocouples to measure the temperature history at various locations of loop. Also the LHP was designed to be transparent to visualize the two phase flow phenomena. Temperature oscillations have been observed in the evaporator, vapor line and condenser during the startup of operation of the LHP. Performance of LHP has been evaluated at a certain range of evaporator heat loads. The minimum thermal resistance of LHP was 0.78 °C/W for a heat load of 100 W while the maximum was 3.1 °C/W for a heat load of 20 W. The maximum heat transfer coefficient in the evaporator was 14114 W/m 2 � for a heat load of 100 W. In addition, it was found that the determination of startup and/or unstart is
Highlights
Heat generation in the electronic system has become a big concern with the advent of new technology
Continuous research has been performed to improve the performance of Loop Heat Pipe (LHP)
Miniature LHP with flat copper disc evaporator can transfer 70 watt and the temperature of the evaporator was below 100° C (Singh et al 2008)
Summary
Heat generation in the electronic system has become a big concern with the advent of new technology. Experiments have been performed on LHP with heat load of 40 to 80 watt with horizontal and vertical orientations using a flat disc-shaped evaporator design (Maidanik et al 2000). An experiment was performed to understand the startup process of LHP with flat evaporator (Tu et al 2009). Miniature LHP with flat copper disc evaporator can transfer 70 watt and the temperature of the evaporator was below 100° C (Singh et al 2008). Copper-water miniature cylindrical LHP was used with load capacity of 130 watt for electronic cooling applications (Maydanik et al 2005). The performance of copper wick are studied to understand the effect of heat load on the evaporator heat transfer coefficient (Maydanik and Vershinin, 2010). Results of the experiment are analyzed and concluding remarks are made at the end of the paper
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