Abstract
In solid-state COB (chip on board) LED (light-emitting diode), the process technology is enhanced, brightness of light per power is improved, and optical performance is increased. However, the COB LED chip junction temperature, Tj, is still a disadvantage in critically high hot spots and high temperatures. These disadvantages can shorten life and reduce efficiency. Therefore, Tj must also be solved. From a single-crystal silicon chip packaging LED to multichip COB packaging LED, this tool has become the most mainstream item in the market development of high brightness. Therefore, investigating the research approach and techniques needed to solve the high temperature Tj is necessary. In this study, the system can be used an environment-friendly refrigerant as R407C and R134a systems for a thermal cooling temperature and constant flow compression refrigeration cycle system that cool ultra-high-power multichip COB and high-brightness gallium indium nitride LED heat source. To reduce the COB LED chip, Tj, temperature needs to reach the following specifications: < 125 °C to maximum 150 °C and Tcase < 50 °C to maximum 85 °C. This temperature will maintain good luminous efficiency and long life. In addition, this approach aims to solve the maximum power of thermal dissipation Tj.
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