Abstract
A hybrid cooling scheme utilizing superlattice coolers (SLCs) along with microchannel heat sink for thermal management of hotspots is presented. In this paper, we have studied the effect of operating and design parameters on the performance of the SLC. We have also experimentally investigated the effect of interface thermal resistance as well as thermal resistance between the ground electrode and superlattice using two test configurations: one with on-chip microchannels and another with off-chip microchannels. We demonstrated heat removal capability at the localized hotspots of more than over 300 W/cm2.
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More From: IEEE Transactions on Components, Packaging and Manufacturing Technology
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