Abstract
This paper presents results on the laser micromachining of TiN films. Machiningperformance was evaluated in terms of patterning quality and the ability toremove TiN with minimal interference with an underlying sacrificial layer. TiNwas arc-deposited onto (100) silicon substrate with chromium (Cr) and copper(Cu) sacrificial layers. Films were also deposited onto bare silicon substrates underthe same conditions. These films were analysed for their compositionand structure using Rutherford backscattering spectroscopy and x-raydiffraction techniques. Laser micromachining was performed using a KrFexcimer laser at 248 nm. The effect of fluence and number of shots on themachined features has been investigated in detail. The patterned features wereexamined using optical, confocal and scanning electron microscopes. Thecharacteristics observed were analysed and compared in all three sets ofsamples. The results showed selective removal of TiN films from Cr and Cusacrificial layers under different conditions. The machining of TiN from(100) silicon showed relatively poor definition of patterned features. Theanalysis of these results indicated that laser machining of TiN from Cr andCu layers is best explained using the explosion mechanism of removal.
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