Abstract
The role of material properties in thin-film multichip module (MCM-D) performance as signal frequencies increase above 100 MHz is examined. Specifically, the impact on system performance of dielectric constant, dielectric loss tangent, interconnect metal resistance, and interconnect metal skin depth is discussed. These properties are compared for common MCM-D materials.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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