Evaluation of the nanomechanical properties of vanadium and native oxide vanadium thin films prepared by RF magnetron sputtering

Abstract

Polycrystalline vanadium thin films of 50, 75, and 100nm thickness were deposited by magnetron sputtering of a vanadium metal target of 2 inch diameter with 99.9% purity on native oxide covered Si substrates. One set of the fabricated samples were kept in moisture free environment and the other set was exposed to ambient air at room temperature for a long period of time that resulted in formation of native oxide prior to testing. The crystal structure and phase purity of the vanadium and the oxidized vanadium thin films were characterized by X-ray diffraction (XRD). The XRD results yield a preferential (110), and (200) orientation of the polycrystalline V films and (004) vanadium oxide (V3O7). The vanadium films thickness were verified using field emission scanning electron microscopy and the films surface morphologies were inspected using atomic force microscopy (AFM). AFM images reveal surface roughness was observed to increase with increasing film thickness and also subsequent to oxidation at room temperature. The nanomechanical properties were measured by nanoindentation to evaluate the modulus and hardness of the vanadium and the oxidized vanadium thin films. The elastic modulus of the vanadium and the oxidized vanadium films was estimated as 150GPa at 30% film thickness and the elastic modulus of the bulk vanadium target is estimated as 135GPa. The measured hardness of the vanadium films at 30% film thickness varies between 9 and 14GPa for the 100 and 50nm films, respectively, exhibiting size effects, where the hardness increases as the film thickness decreases. The hardness of the oxidized films depicted less variation and is reported as ∼10GPa at 30% film thickness for the three oxides. The scanning electron microscopy (SEM) imaging depicted a gradual progression of pile up as the film thickness increased from 75 to 100nm. It is noticed that as the film thickness increases the films experience softening effect due to grain coarsening and the hardness values depict the hardness of the Si substrate at deep indents.