Abstract

The morphology of telephone cord buckles of elastic thin films can be used to evaluate the initial residual stress and interface toughness of the film–substrate system. The maximum out-of-plane displacement δ , the wavelength λ and amplitude A of the wave buckles can be measured in physical experiments. Through δ , λ , and A , the buckle morphology is obtained by an annular sector model established using the von Karman plate equations in polar coordinates for the elastic thin film. The mode-mix fracture criterion is applied to determine the shape and scale parameters. A numerical algorithm combining the Newmark- β scheme and the Chebyshev collocation method is adopted to numerically solve the problem in a quasi-dynamic process. Numerical experiments show that the numerical results agree well with physical experiments.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.