Abstract
► We propose a mechanical test of electroplated Ni film using micro-sized cantilever. ► Two micro-sized cantilevers are fabricated. ► The beam directions are parallel or vertical to crystal growth direction. ► The bending tests are conducted with test machine designed for micro-sized specimens. ► Cantilever with beam direction parallel to growth direction is stronger than another. We propose a method of mechanical test for measuring strength of electrodeposited Ni film using micro-sized cantilever. Two cantilevers were fabricated for each beam direction parallel and vertical to grain growth direction. Bending tests were carried out with a test machine designed for micro-sized specimens. Bending tests of the two cantilever specimens showed that strength of the cantilever which beam direction is parallel to grain growth direction is higher than that of vertical to grain growth direction. EBSD analysis of the specimens after the bending test implies that difference in strength was caused by deformation twin.
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