Error Modeling of Seebeck Coefficient Measurements Using Finite-Element Analysis

Abstract

Using finite-element analysis, we have developed a metrology simulation to model errors in the measurement of the Seebeck coefficient. This physical parameter is the constant of proportionality relating the electric potential generated across a conductor to the applied thermal gradient. Its measurement requires careful attention to the electrical and thermal contact interfaces. Furthermore, it is essential that the electric potential and temperature difference be acquired at the same time and at the same location. We have performed Seebeck coefficient measurement simulations to quantitatively explore the effect of temporal perturbation to the voltage and temperature correspondence, by comparing simultaneous and staggered data acquisition techniques under the quasi-steady-state condition. Using a similar method, we have developed an error model to explore the effect of misalignment between the voltage and temperature probes on the measurement of the Seebeck coefficient. This approach enables the exploration of experimentally inaccessible data spaces under ideal conditions.