Abstract
Erect Au nanocones with high adhesion to substrates are obtained by simply drawing from Au nano-films through Au-Si eutectic welding. Nanocones with diameters ranging from about 5 to 150 nm and length ranging from about 60 to 600 nm can be observed on both Au and Si substrate surfaces. Nano-scale Au-Si eutectics formed at the rough Au–silicon film interface under annealing at 450 °C and the subsequent cooling process facilitate the formation of nano-bonding points and draw Au nanocones from Au nano-film by mechanical separation. Erect Au nanocones adhered to Au or Si substrates shows higher light enhancement than itself, observed by FDTD simulation. This method provides new strategy for the fabrication of SERS detectors, solar cells et al. with high stability.
Highlights
Au nanocones with fairly distinguished light enhancement resulting from their sharp tip have attracted a lot of attention in Surface-Enhanced Raman Scattering (SERS) detectors, solar cells for light management [1,2]
The reason why annealing cannot be used to improve the adhesion of erect Au nanocones with substrates is because of the low temperature ripening of Au nanocones due to the size effect [8]
We report a new way for fabricating erect Au nanocones with high adhesion to
Summary
Au nanocones with fairly distinguished light enhancement resulting from their sharp tip have attracted a lot of attention in Surface-Enhanced Raman Scattering (SERS) detectors, solar cells for light management [1,2]. In addition to the sophisticated processes or huge costs of these methods, the low adhesion of Au nanocones with substrates seems unavoidable due to the lack of welding through annealing processes in most methods. The reason why annealing cannot be used to improve the adhesion of erect Au nanocones with substrates is because of the low temperature ripening of Au nanocones due to the size effect [8]. Even under relatively low temperature annealing, the morphologies of Au nanocones could be changed. Such low adhesion can significantly limit the stability or even service life of the devices
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