Abstract
Semiconductor packaging generally includes many steps such as wafer mounting, wafer dicing, die attach or die bonding, wire bonding, molding, plating, marking, and trim form. Die attach process is one of the crucial process in electronics packaging or semiconductor packaging. So, the die attaches material is an important part of this process. Die attach materials are commonly divided into some categories. The categories cover high and low-temperature application. Some kinds of die attach materials are alternative resins, epoxy adhesive, soft soldering, die attach solders and silver-glass material. In this study focuses to review epoxy adhesive material in die attach process.
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