Abstract
Micron silver paste enables a low-temperature and pressureless sintering process by using an ether-type solvent CELTOL-IA (C x H y O z , x > 10, boiling point of approximately 200°C) for the die attachment of high-powered devices. The conductive patterns formed by the silver paste had a low electrical resistivity of 8.45 μΩ cm at 180°C. The paste also achieved a high bonding strength above 30 MPa at 180°C without the assistance of pressures. These superior performance indicators result from the favorable removal of the solvent, its thermal behavior, and its good wetting on the silver layer. The results suggest that the micron silver paste with a suitable␣solvent can promote the further spreading of next-generation power devices owing to its marked cost advantage and excellent performance.
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