Abstract

A robust FinFET silicon-controlled rectifier (SCR) LDMOS ESD protection device is developed. Replacing the drain contact implant to the P+ implant from N+ implant creates an SCR inside the LDMOS and when the N+ contact is removed a Schottky SCR LDMOS is created. The ESD performance of the baseline FinFET LDMOS is Zero, while that of the SCR LDMOS is 9.2 mA/ $\mu {\mathrm{ m}}$ and Schottky SCR is 4.6 mA/ $\mu \text{m}$ respectively.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.