Abstract
Enabling zero delamination in automotive power electronics is a key factor to meet environmentally demanding applications and stringent standards set by the automotive industry as delamination impacts overall package quality and device reliability. This study aims to evaluate potential electronic packaging solutions that will enable delamination-free packages for automotive power applications. Fractional factorial experimental design was used to investigate the effect and interaction of surface roughening, epoxy molding compound optimization and alternative deflash method in package interfacial delamination after assembly manufacturing and MSLI preconditioning. Extended environmental stress tests were performed to further validate the robustness of the proposed solutions. Overall results showed that EMC optimization has the highest impact to reduce delamination on package interfaces. Combination of the proposed packaging solutions successfully enabled an MSLI delamination-free robust clip bond power package that is highly capable of surviving harsh environments furthermore meeting the highest automotive quality standards.
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