Abstract
The materials that are used to create low temperature co-fired ceramics (LTCC) circuits (produced from green tape and various pastes) can be processed by the equipment of the conventional thick-film technology (screen printing machine, drying and burning ovens). The equipment needed to produce multilayer boards (sinter press, tools, punching machine or Nd-YAG laser) can be purchased with a little investment. At the same time the high temperature co-fired ceramics (HTCC) technology requires completely new equipment, so the changeover is harder and more expensive. An LTCC test-circuit was designed and realized by using the thick-film technology equipment at the Department of Electronics Technology, BME. The surface and embedded resistors were made from thick-film paste. In the course of the realization and with circuit measurements it could be determined what have to be considered at the pre-calculation of the resistor values.
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