Abstract
We present a novel ultra-compact embedded IC integration approach for system-on-package (SOP) based solutions for RF and wireless communication applications. This concept is applied to the integration of a Ku band VCO module. The module fabrication is described and the impact of the packaging on the chip-set performances is discussed. The final thickness of the module is about 150 μm. The embedded VCO exhibits an oscillation frequency of 15.4 GHz, a phase noise of -99.2 dBc/Hz at a 1 MHz offset and maximum output power of 10.67 dBm. Multilayer interconnects built with modified MCM-D technology using advanced photosensitive epoxy Intervia 8000 is described. Characterization and modeling of RF inductors are detailed and show quality factor as high as 80 at 10 GHz.
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