Abstract

ABSTRACTThe construction and design features of current generation micro‐technology electronics result in devices which can be destroyed or degraded by the discharge of static electricity. This electrostatic discharge (ESD) damage phenomenon became known in industry because of low yields of metal oxide semiconductors and other ESD sensitive items, especially at the device production level. Yet today, overall industry implementation of ESD controls is not uniform and is not being instituted at a satisfactory rate. Worse, the Government and Navy personnel are generally even less knowledgeable of ESD hazards, their effects, and what to do about it. This lack of knowledge is resulting in unnecessary repair costs, excessive equipment downtime, and reduced mission effectiveness in that electrical/electronic devices and equipment which incorporate them are being damaged throughout the equipment life‐cycle during processing, assembly, inspection, handling, packaging, shipping, storage, testing, and maintenance. Unfortunately, even if the equipment or device contractor has instituted procedures for ESD control, very little of this information is reflected in Government training course materials and in other documents such as Technical Manuals. ESD controls, therefore, must be established and implemented throughout all phases of hardware design, production, test, and Fleet operation and maintenance.

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