Abstract
To replace NiFe alloys used as flux guides in magnetic microelectromechanical systems, electroplated CoFe thin films were examined. The films were deposited using pulse plating. The results show a strong influence of the reverse current Ireverse on the deposition rate and the saturation flux density Bs. The relative permeability μr is influenced both by the forward current Iforward and by reverse current Ireverse. Based on the examinations an optimized deposition was performed. A film thickness of 15μm was reached during a deposition time of 1h. This film exhibited a saturation flux density Bs of 1.4T, a coercivity Hc of 1130kA∕m, and a relative permeability μr of 290. At this thickness, no delamination occurred and the film showed only minor signs of corrosion, a phenomenon CoFe films are typically prone to.
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