Abstract
The present study investigates the microstructure and grain boundaries evolutions during recrystallization of commercial FeCo-∼7 wt.% V. The resulting microstructures were characterized using electron back scatter diffraction after annealing at different temperatures. At low temperatures (∼400 °C), where only recovery occurs during annealing, the fraction of low angle boundaries was increased. But, at high temperatures (∼850 °C), where recrystallization occurs during annealing, the fraction of high angle boundaries and low-Σ coincidence site lattice (CSL) boundaries (especially Σ3) were increased.
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