Abstract
Reactive ion etching and reactive ion beam etching are common tools for anisotropic etch processes in silicon microdevice fabrication; but, unfortunately, they also create radiation damage in the etched surface. We have studied the electrically active defects by measuring the recombination of carriers with the help of the electron beam induced current (EBIC) mode of a secondary electron microscope. We have measured the temperature behavior of the samples by annealing studies and the temperature dependent EBIC signal for several p-doped silicon wafers and obtained different shaped curves. Theoretical EBIC models developed with the assumption of a reduced net carrier concentration in the etched areas agree with our experimental results.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.