Abstract
Cu nanostructures deposited on the top of self-assembled molecular patterns prepared by Dip-pen Nanolithography (DPN) are investigated thoroughly in this study. 16-Mercaptohexadecanoic acid (MHA) molecular patterns are used as templates and CuSO4 is reduced by electroless deposition method. According to the SEM, EDS and AFM test results, it is found that the formation and the dimension of the Cu nanostructure array can be governed by reaction conditions and the size of molecular patterns. The non-specific growth of Cu can also be minimized in the present work. The method designed has demonstrated its capability in the synthesis of molecular junctions with high reproducibility. Distinct phenomena of underpotential deposition behaviors of Cu on polycrystalline gold substrates covered with self-assembled monolayers of 16-mercaptohexadecanoic acid and octadecanethiol are also studied and discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
