Abstract
Ag–Ni alloy films were electrodeposited from thiourea-based acidic solutions. Electrochemical studies confirmed the strong polarization of Ag deposition due to the strong complexation of Ag+ with thiourea, bringing the onset of Ag and Ni deposition closer, potentially favoring alloy formation. The as-deposited films were very fine grained (less than 20nm) and consisted of various phases: a supersaturated solid solution of Ni in Ag and a Ni-rich nanocrystalline or amorphous phase, preferentially formed at grain boundaries. Ag-rich films were smooth, while a higher Ni content resulted in increasingly rough and porous films. Decomposition of the metastable phase and precipitation of the pure elemental phases occurred upon thermal annealing at 600°C. Reduction of thiourea induced by Ni deposition led to sulfur incorporation in the films, up to 20at.%.
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